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Taconic TLY-5Z DK2.20 Df0.0015 (0.254-1.524mm) Copper Clad Laminate
Brief Introduction
TLY-5Z is an advanced glass-filled PTFE composite reinforced with woven fiberglass, designed by Taconic for high-frequency printed circuit board applications where low weight and dimensional stability are critical. This material offers a unique balance of low density, excellent electrical properties, and enhanced mechanical performance, making it ideal for aerospace, millimeter-wave antennas, and high-reliability RF systems.
Technical Features & Benefits
Low and Stable Dielectric Constant: Dk = 2.20 ±0.04 at 10 GHz, ensuring consistent signal integrity.
Low Dissipation Factor: 0.0015 at 10 GHz, suitable for high-frequency and low-loss designs.
Low Density and Weight: Density of 1.92 g/cm³, ideal for weight-sensitive applications.
Excellent Thermal Dimensional Stability: Low Z-axis CTE (130 ppm/°C) and improved drilling performance.
High Mechanical Strength: Strong peel strength, tensile modulus, and flexural properties for reliable PCB fabrication.
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Typical Properties:
| Property |
Conditions |
Value |
Unit |
Test Method |
| Dielectric Constant | @ 10 GHz | 2.20 ± 0.04 | – | IPC-650 2.5.5.5.1 Mod. |
| Dissipation Factor | @ 10 GHz | 0.0015 | – | IPC-650 2.5.5.5.1 Mod. |
| Volume Resistivity | – | 10⁹ | MΩ·cm | IPC-650 2.5.17.1 |
| Surface Resistivity | – | 10⁸ | MΩ | IPC-650 2.5.17.1 |
| Dielectric Breakdown Voltage | – | 45 | kV | IPC-650 2.5.6 |
| Dielectric Strength | – | 770 | V/mil | IPC-650 2.5.6.2 |
| Temperature Coefficient of Dk | -55°C to 150°C | -72 | ppm/°C | IPC-650 2.5.5.6 Mod. |
| Thermal Conductivity | – | 0.2 | W/(m·K) | IPC-650 2.4.50 |
| CTE – X | 25–260°C | 30 | ppm/°C | IPC-650 2.4.41 |
| CTE – Y | 25–260°C | 40 | ppm/°C | IPC-650 2.4.41 |
| CTE – Z | 25–260°C | 130 | ppm/°C | IPC-650 2.4.41 |
| Peel Strength | 1 oz copper | 7 | lbs/inch | IPC-650 2.4.8 |
| Tensile Strength – MD | – | 9,137 | psi | IPC-650 2.4.18.3 |
| Tensile Strength – CD | – | 9,572 | psi | IPC-650 2.4.18.3 |
| Tensile Modulus – MD | – | 182,748 | psi | IPC-650 2.4.18.3 |
| Tensile Modulus – CD | – | 165,344 | psi | IPC-650 2.4.18.3 |
| Elongation – MD | – | 6 | % | IPC-650 2.4.18.3 |
| Elongation – CD | – | 6.9 | % | IPC-650 2.4.18.3 |
| Flexural Strength – MD | – | 10,300 | psi | ASTM D790 |
| Flexural Strength – CD | – | 11,600 | psi | ASTM D790 |
| Flexural Modulus – MD | – | 377,100 | psi | ASTM D790 |
| Flexural Modulus – CD | – | 432,213 | psi | ASTM D790 |
| Dimensional Stability (MD – Bake) | 10 mil, 30 mil | -0.05%, -0.05% | % | IPC-650 2.4.39 |
| Dimensional Stability (CD – Bake) | 10 mil, 30 mil | -0.17%, -0.11% | % | IPC-650 2.4.39 |
| Density | – | 1.92 | g/cm³ | IPC-650 2.3.5 |
| Specific Heat | – | 0.95 | J/(g·°C) | IPC-650 2.4.50 |
| Moisture Absorption | – | 0.03 | % | IPC-650 2.6.2.1 |
| Hardness (Durometer) | – | 68 | – | ASTM D2240 |
| Flammability Rating | – | V-0 | – | UL 94 |
Application Areas
Aerospace Components: Low-weight antennas, avionics systems, and satellite payloads.
Millimeter-Wave Antennas: Automotive radar (77 GHz), 5G communication systems.
RF Passive Components: Power dividers, filters, couplers, combiners.
High-Frequency Hybrid PCBs: Multilayer and double-sided designs for commercial and defense electronics.
Lightweight Electronic Assemblies: UAVs, airborne communication systems, and phased array antennas.
PCB Manufacturing Capability (TLY-5 Series):
PCB Parameter: Available Options
Layer Count: Double-sided, Multilayer, Hybrid designs
Laminate Thickness: 10 mil (0.254 mm), 20 mil (0.508 mm), 30 mil (0.762 mm), 60 mil (1.524 mm), customizable in 10 mil increments
Copper Weight: 1 oz (35 µm), 2 oz (70 µm)
Max PCB Size: ≤ 400 mm × 500 mm
Solder Mask Colors: Green, Black, Blue, Yellow, Red, etc.
Surface Finishes: Immersion Gold, HASL, Immersion Silver, Immersion Tin, OSP, Pure Gold, ENEPIG, Bare Copper, etc.
Note:
TLY-5Z is part of the TLY laminate family, which includes variants with dielectric constants from 2.17 to 2.33. TLY-5 is typically kept in stock, while other grades can be sourced based on customer requirements.
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